The Common Platform and True Circuits
GLOBALFOUNDRIES, IBM, and Samsung jointly developed the Common Platform
(CP), an advanced technology platform based on a leading-edge process
technology at 90nm, 65nm, 45nm and 28nm, with a roadmap to 14nm. With it, a single
design can be manufactured at any of the three fabs. GLOBALFOUNDRIES, IBM
and Samsung also collaborate with various EDA, IP and design services
partners to offer a comprehensive and open ecosystem that allows customers
to share IP and design rules and potentially reduce development costs.
True Circuits has been an active IP partner to the Common Platform since
2005, when it began a close technical association with GLOBALFOUNDRIES. True
Circuits has since ported its family of standard PLL and DLL hard macros to
the CP 90nm, 65nm and 28nm processes and developed test chips with GF in
each variant of each process. True Circuits has performed extensive
parametric testing on the 90nm, 65nm and 28nm IP in our silicon lab using
state-of-the-art Agilent test equipment and silicon test reports are
available upon request. Due to GDSII compatibility
between CP technology manufacturers, this same IP can be made available at
additional manufacturers upon request.
The entries in the tables below are links to individual datasheets for our
standard PLL and DLL hard macros now available in the Common Platform 90nm,
65nm and 28nm processes. Downloadable versions of the individual datasheets
have been added for your convenience. These standard products are also
available in higher frequencies, smaller sizes, flexible form factors and
full-custom versions upon request.
Over the years, TCI has delivered a wide range of PLL and DLL IP to
GLOBALFOUNDRIES, IBM and Samsung customers. Please contact your foundry or
TCI sales representative to find out how your products can benefit from the
quality, performance and availability of our industry leading timing IP.
About the Common Platform
IBM, GLOBALFOUNDRIES and Samsung have broken new ground in the semiconductor
industry with a unique collaboration focused on leading-edge, jointly
developed digital CMOS process technologies and advanced manufacturing. As a
result of the involvement of IDMs, systems companies, and foundries, the
jointly developed processes bring a new level of system and application
understanding to the silicon process. The Common Platform model is
supported by a comprehensive ecosystem of design enablement and
implementation partners from the EDA, IP and design services industries.
Common Platform technology features 90nm, 65nm, 45nm and 28nm process
technologies developed as part of a collaboration between IBM, GLOBALFOUNDRIES,
Samsung and Infineon. Freescale has recently joined in the joint process
development alliance (JDA) for the 45nm and 28nm technology nodes.
For more information about the Common Platform and its manufacturing
partners, see the following:
Common Platform: www.commonplatform.com
Samsung Electronics: www.samsung.com